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V23990-P640-H10-PM 参数 Datasheet PDF下载

V23990-P640-H10-PM图片预览
型号: V23990-P640-H10-PM
PDF下载: 下载PDF文件 查看货源
内容描述: [Optionally with brake chopper]
分类和应用:
文件页数/大小: 16 页 / 1529 K
品牌: VINCOTECH [ VINCOTECH ]
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V23990-P640-G10/H10-PM  
preliminary datasheet  
Characteristic Values  
Conditions  
Value  
Typ  
Parameter  
Symbol  
Unit  
Vr(V) or  
VGE(V) or  
IC(A) or IF(A)  
or ID(A)  
VCE(V) or  
T(°C)  
Min  
Max  
VGS(V)  
VDS(V)  
Input Rectifier Bridge  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=150°C  
1
1,17  
1,13  
0,91  
0,78  
3
1,5  
VF  
Vto  
rt  
Forward voltage  
75  
V
V
Threshold voltage (for power loss calc. only)  
Slope resistance (for power loss calc. only)  
Reverse leakage current  
m  
mA  
K/W  
5
0,5  
1,5  
Ir  
1500  
RthJH  
RthJC  
Thermal resistance chip to heatsink per chip  
Thermal resistance chip to case per chip  
Thermal grease  
thickness 50um λ=  
0.61W/mK  
1,04  
n.A.  
Input Rectifier Thyristor  
Forward voltage  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=130°C  
Tj=25°C  
Tj=130°C  
Tj=25°C  
Tj=130°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=130°C  
Tj=25°C  
Tj=115°C  
1
1,37  
1,45  
0,94  
0,86  
6
2
VF  
Vto  
75  
V
V
Threshold voltage (for power loss calc. only)  
Slope resistance (for power loss calc. only)  
Reverse current  
rt  
mΩ  
mA  
ms  
ms  
V/μs  
A/μs  
ms  
mA  
mA  
V
8
0,2  
Ir  
1
2
tGD  
Gate controlled delay time  
Gate controlled rise time  
Ig=1A dig/dt=1A/s  
Ig=1A dig/dt=1A/s  
1072  
1072  
tGR  
Critical rate of rise of off-state voltage  
Critical rate of rise of on-state current  
Circuit-commutated turn-off time  
Holding current  
(dv/dt)cr  
(di/dt)cr  
tq  
1000  
50  
150  
165  
330  
1,98  
100  
IH  
IL  
Latching current  
VGT  
IGT  
VGD  
IGD  
Gate trigger voltage  
Gate trigger current  
A
Gate non-trigger voltage  
V
0,25  
6
Gate non-trigger current  
A
RthJH  
RthJC  
Thermal resistance chip to heatsink per chip  
Thermal resistance chip to case per chip  
Thermal grease  
thickness 50um λ=  
0.61W/mK  
1,12  
n.A.  
K/W  
K/W  
Copyright by Vincotech  
4
Revision: 1