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V23990-K427-A40-1B-PM 参数 Datasheet PDF下载

V23990-K427-A40-1B-PM图片预览
型号: V23990-K427-A40-1B-PM
PDF下载: 下载PDF文件 查看货源
内容描述: [Trench Fieldstop IGBT4 technology]
分类和应用: 双极性晶体管
文件页数/大小: 17 页 / 1717 K
品牌: VINCOTECH [ VINCOTECH ]
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V23990-K427-A40-PM  
Characteristic Values  
Conditions  
Value  
Typ  
Parameter  
Symbol  
Unit  
Vr [V] or  
VGE [V] or  
IC [A] or  
IF [A] or  
ID [A]  
VCE [V] or  
Tj  
Min  
Max  
VGS [V]  
VDS [V]  
D8,D9,D10,D11,D12,D13  
Forward voltage  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
Tj=25°C  
Tj=125°C  
0,8  
1,34  
1,27  
0,85  
0,75  
14  
1,35  
VF  
Vto  
rt  
35  
35  
35  
V
V
Threshold voltage (for power loss calc. only)  
Slope resistance (for power loss calc. only)  
Reverse current  
m  
mA  
15  
0,1  
1,1  
Ir  
1500  
Thermal grease  
RthJH  
thickness50m  
λ=1W/mK  
K/W  
Thermal resistance chip to heatsink per chip  
0,90  
T1,T2,T3,T4,T5,T6,T7  
Gate emitter threshold voltage  
Collector-emitter saturation voltage  
Collector-emitter cut-off current incl. Diode  
Gate-emitter leakage current  
Integrated Gate resistor  
Turn-on delay time  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
5
5,8  
6,5  
2,1  
VGE(th) VCE=VGE  
0,0008  
35  
V
V
1,6  
1,87  
2,30  
VCE(sat)  
ICES  
IGES  
Rgint  
td(on)  
tr  
15  
0
0,005  
120  
600  
0
mA  
nA  
20  
-
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
78  
79  
24  
Rise time  
29  
ns  
196  
268  
77  
131  
2,54  
3,84  
1,92  
3,18  
td(off)  
tf  
Turn-off delay time  
Rgoff=16 ꢁ  
Rgon=16 ꢁ  
±15  
600  
35  
Fall time  
Eon  
Turn-on energy loss per pulse  
Turn-off energy loss per pulse  
Input capacitance  
mWs  
pF  
Eoff  
Cies  
Coss  
Crss  
QGate  
1950  
155  
115  
203  
Output capacitance  
f=1MHz  
0
25  
Tj=25°C  
Tj=25°C  
Reverse transfer capacitance  
Gate charge  
±15  
960  
40  
nC  
Thermal grease  
thickness50m  
λ=1W/mK  
RthJH  
K/W  
Thermal resistance chip to heatsink per chip  
0,85  
D1,D2,D3,D4,D5,D6,D7  
Diode forward voltage  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
Tj=25°C  
Tj=150°C  
2,37  
2,35  
16  
2,62  
2,62  
VF  
IRRM  
trr  
35  
35  
V
A
Peak reverse recovery current  
Reverse recovery time  
23  
336  
550  
2,20  
5,36  
63  
67  
0,77  
2,07  
ns  
Qrr  
Reverse recovered charge  
Peak rate of fall of recovery current  
Reverse recovered energy  
Rgoff=16 ꢁ  
±15  
600  
µC  
di(rec)max  
/dt  
A/µs  
mWs  
Erec  
Thermal grease  
thickness50m  
λ=1W/mK  
RthJH  
K/W  
Thermal resistance chip to heatsink per chip  
1,2  
Thermistor  
Rated resistance  
Deviation of R100  
R100  
R
T=25°C  
T=100°C  
T=100°C  
T=25°C  
T=25°C  
T=25°C  
1000  
%
R/R R100=1670 ꢁ  
-3  
3
P
1670,313  
Power dissipation constant  
A-value  
mW/K  
1/K  
1/K²  
B(25/50) Tol. %  
B(25/100) Tol. %  
7,635*10-3  
1,731*10-5  
B-value  
Vincotech NTC Reference  
E
copyright Vincotech  
3
Revision: 1.1