BCM4414xG0F4440yzz
General Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
L
L
Lug (Chassis) Mount
110.30 [4.34] 110.55 [4.35] 110.80 [4.36]
112.51 [4.43] 112.76 [4.44] 113.01 [4.45]
mm [in]
mm [in]
mm [in]
mm [in]
cm3 [in3]
g [oz]
Length
PCB (Board) Mount
Width
W
H
35.29 [1.39]
35.54 [1.40]
9.40 [0.37]
36.93 [2.25]
145 [5.115]
35.79 [1.41]
Height
9.019 [0.355]
9.781 [0.385]
Volume
Weight
Vol
W
Without heatsink
Pin Material
Underplate
C145 copper
Low-stress ductile Nickel
Palladium
50
0.8
100
6
µin
µin
µin
Pin Finish (Gold)
Pin Finish (Tin)
Soft Gold
0.12
200
2
Whisker-resistant matte Tin
400
Thermal
BCM4414xG0F4440yzz (T-Grade)
BCM4414xG0F4440yzz (C-Grade)
BCM4414xG0F4440yzz (M-Grade)
–40
–20
–55
125
125
125
Operating Internal Temperature
Operating Case Temperature
TINT
°C
°C
BCM4414xG0F4440yzz (T-Grade),
de-rating applied, see safe thermal
operating area
–40
–20
–55
100
100
100
BCM4414xG0F4440yzz (C-Grade),
de-rating applied, see safe thermal
operating area
TCASE
BCM4414xG0F4440yzz (M-Grade),
de-rating applied, see safe thermal
operating area
Estimated thermal resistance to
maximum temperature internal
component from isothermal pin/
terminal-side housing
Thermal Resistance Pin Side
Thermal Resistance Housing
θINT_PIN_SIDE
1.5
°C/W
°C/W
Estimated thermal resistance of thermal
coupling between the pin-side and
non-pin-side case surfaces
θHOU
0.28
Estimated thermal resistance to
maximum temperature internal
component from isothermal non-pin/
non-terminal housing
Thermal Resistance Non-Pin Side
Thermal Capacity
θINT_NON_PIN_SIDE
1.6
54
°C/W
Ws/°C
Assembly
BCM4414xG0F4440yzz (T-Grade)
BCM4414xG0F4440yzz (C-Grade)
BCM4414xG0F4440yzz (M-Grade)
–40
–40
–65
125
125
125
Storage Temperature
ESD Withstand
TST
°C
Human Body Model,
“ESDA / JEDEC JDS-001-2012” Class I-C
(1kV to < 2kV)
Charge Device Model,
“JESD 22-C101-E” Class II (200V to
< 500V)
ESDHBM
ESDCDM
1000
200
BCM® in a VIA™ Package
Page 18 of 44
Rev 1.7
10/2020
VICOR [ VICOR CORPORATION ]
