BCM4414xD1E2663yzz
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
Min
Max
480
N/A
30
Unit
V
+HI to –HI
–1
HI_DC or LO_DC Slew Rate
+LO to –LO
Internal hot-swap circuitry
V/µs
V
–1
–0.3
10
V
EXT BIAS to SGND
0.15
5.5
5.5
3.6
A
SCL to SGND
SDA to SGND
ADDR to SGND
–0.3
–0.3
–0.3
2121
V
V
V
Basic insulation (high voltage side to case)
Basic insulation (high voltage side to low voltage side) [b]
(low voltage side to case)
VDC
Isolation Voltage /
Dielectric Withstand
2121
N/A
VDC
VDC
[b] The absolute maximum rating listed above for the dielectric withstand (high voltage side to the low voltage side) refers to the VIA package. The internal
safety approved isolating component (ChiP) provides reinforced insulation (4242V) from the high voltage side to the low voltage side. However, the VIA
package itself can only be tested at a basic insulation value (2121V).
BCM® in a VIA Package
Page 5 of 43
Rev 1.1
01/2018