BCM3814x60E15A3yzz
160
140
120
100
80
60
40
20
0
-60
-40
-20
0
20
40
60
80
100
120
Case Temperature (°C)
36 – 60V
Figure 1 — Specified thermal operating area
1. The BCM in a VIA package is cooled through the bottom case (bottom housing).
2. The thermal rating is based on typical measured device efficiency.
3. The case temperature in the graph is the measured temperature of the bottom housing, such that the internal operating temperature
does not exceed 125°C.
2200
2000
1800
1600
1400
1200
1000
800
200
180
160
140
120
100
80
60
600
400
40
20
200
0
0
36 38 40 42 44 46 48 50 52 54 56 58 60
36 38 40 42 44 46 48 50 52 54 56 58 60
HI Side Voltage (V)
HI Side Voltage (V)
ILO_OUT_DC
ILO_OUT_PULSE
PLO_OUT_DC
PLO_OUT_PULSE
Figure 2 — Specified electrical operating area using rated RLO_HOT
110
100
90
80
70
60
50
40
30
20
10
0
0
20
40
60
80
100
LO Side Current (% ILO_DC
)
Figure 3 — Specified HI side start up into load current and external capacitance
BCM® in a VIA Package
Page 9 of 41
Rev 2.0
02/2018