BCM3814x60E15A3yzz
Absolute Maximum Ratings
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.
Parameter
Comments
Min
Max
80
Unit
V
+HI to –HI
–1
HI_DC or LO_DC Slew Rate
+LO to –LO
1
V/µs
V
–1
20
–0.3
10
V
EXT BIAS to SGND
0.15
5.5
5.5
3.6
A
SCL to SGND
SDA to SGND
ADDR to SGND
–0.3
–0.3
–0.3
1500
1500
N/A
V
V
V
Basic insulation (high voltage side to case)
VDC
VDC
VDC
Isolation Voltage /
Dielectric Withstand
Basic insulation (high voltage side to low voltage side) [c]
Functional insulation (low voltage side to case)
[c] The absolute maximum rating listed above for the dielectric withstand (high voltage side to the low voltage side) refers to the VIA package. The internal
safety approved isolating component (ChiP) provides basic insulation (2250V) from the high voltage side to the low voltage side. However, the VIA package
itself can only be tested at a basic insulation value (1500V).
BCM® in a VIA Package
Page 5 of 41
Rev 2.0
02/2018