BCM3814x60E15A3yzz
General Characteristics
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of
–40°C ≤ TCASE ≤ 100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.
Attribute
Symbol
Conditions / Notes
Min
Typ
Max
Unit
Mechanical
Length
L
L
Lug (Chassis) Mount
95.34 [3.75]
97.55 [3.84]
35.29 [1.39]
9.019 [0.355]
95.59 [3.76]
97.80 [3.85]
35.54 [1.40]
9.40 [0.37]
31.93 [1.95]
130.4 [4.6]
95.84 [3.77]
98.05 [3.86]
35.79 [1.41]
9.781 [0.385]
mm [in]
mm [in]
mm [in]
mm [in]
cm3 [in3]
g [oz]
Length
PCB (Board) Mount
Width
W
H
Height
Volume
Weight
Vol
W
Without heatsink
Pin Material
Underplate
C145 copper
Low stress ductile Nickel
Palladium
50
0.8
100
6
µin
µin
µin
Pin Finish (Gold)
Pin Finish (Tin)
Soft Gold
0.12
200
2
Whisker resistant matte Tin
400
Thermal
BCM3814x60E15A3yzz (T-Grade)
BCM3814x60E15A3yzz (C-Grade)
–40
–20
125
125
Operating Internal Temperature
Operating Case Temperature
TINT
BCM3814x60E15A3yzz (T-Grade),
derating applied, see safe thermal
operating area
–40
–20
100
100
°C
TCASE
BCM3814x60E15A3yzz (C-Grade),
derating applied, see safe thermal
operating area
Estimated thermal resistance to
maximum temperature internal
component from isothermal top
Thermal Resistance Top Side
θINT_TOP
0.97
0.58
°C/W
°C/W
Estimated thermal resistance of thermal
coupling between the top and bottom
case surfaces
Thermal Resistance Coupling Between
Top Case and Bottom Case
θHOU
Estimated thermal resistance to
maximum temperature internal
component from isothermal bottom
Thermal Resistance Bottom Side
Thermal Capacity
θINT_BOT
0.59
52
°C/W
Ws/°C
Assembly
BCM3814x60E15A3yzz (T-Grade)
BCM3814x60E15A3yzz (C-Grade)
–40
–40
125
125
°C
°C
Storage Temperature
ESD Withstand
TST
Human Body Model,
“ESDA / JEDEC JDS-001-2012” Class I-C
(1kV to < 2kV)
ESDHBM
1000
200
Charge Device Model,
“JESD 22-C101-E” Class II (200V to
< 500V)
ESDCDM
BCM® in a VIA Package
Page 17 of 41
Rev 2.0
02/2018
VICOR [ VICOR CORPORATION ]
