End of Life - BCM352x110T300B00 Recommended
Behavioral & Test Circuits
Input reflected ripple
measurement point
F1
1.5 A
Fuse
+Out
-Out
Notes:
+In
+
Load
–
Enable/Disable Switch
Source inductance should be no more than 200 nH. If source inductance is
greater than 200 nH, additional bypass capacitance may be required.
R3
5 mΩ
TM
C1
2 µF
BCM
R2
RSV
C3 should be placed close to the load.
2 kΩ
PC
electrolytic
C3
10 µF
+Out
D1
SW1
R3 may be ESR of C3 or a separate damping resistor.
D1 power good indicator will dim when a module fault is detected.
K
Ro
-In
-Out
Figure 18 — BCM test circuit
V•I Chip Bus Converter Level 1 DC Behavioral Model for 352 V to 11 V, 300 W
ROUT
IOUT
+
9.8 m
+
1/32 • Iout
1/32 • Vin
•
V I
+
–
+
–
VOUT
VIN
Q
I
18 mA
K
–
–
©
Figure 19 — This model characterizes the DC operation of the V•I Chip bus converter, including the converter transfer function and its losses. The model enables
estimates or simulations of output voltage as a function of input voltage and output load, as well as total converter power dissipation or heat generation.
V•I Chip Bus Converter Level 2 Transient Behavioral Model for 352 V to 11 V, 300 W
0.22 nH
Lout = 1.1 nH
ROUT
IOUT
IN
L
= 5 nH
+
9.8 mΩ
+
RCOUT
RCIN
1.1 mΩ
1/32 • Vin
V•I
K
0.2 mΩ
32 mΩ
1/32 • Iout
+
–
+
–
37 µF
0.3µF
CIN
COUT
VOUT
VIN
IQ
18 mA
–
–
©
Figure 20 — This model characterizes the AC operation of the V•I Chip bus converter including response to output load or input voltage transients or steady state
modulations. The model enables estimates or simulations of input and output voltages under transient conditions, including response to a stepped load with or
without external filtering elements.
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00
Rev. 1.6
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