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BCD352F110T300A00 参数 Datasheet PDF下载

BCD352F110T300A00图片预览
型号: BCD352F110T300A00
PDF下载: 下载PDF文件 查看货源
内容描述: [HV BCM BUS CONVERTER EVAL BOARD]
分类和应用:
文件页数/大小: 11 页 / 1584 K
品牌: VICOR [ VICOR CORPORATION ]
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End of Life - BCM352x110T300B00 Recommended  
Configuration Options  
RECOMMENDED LAND PATTERN  
(NO GROUNDING CLIPS)  
TOP SIDE SHOWN  
NOTES: 1. MAINTAIN 3.50 [0.138] DIA. KEEP-OUT ZONE  
FREE OF COPPER, ALL PCB LAYERS.  
2. (A) MINIMUM RECOMMENDED PITCH IS 39.50 [1.555],  
THIS PROVIDES 7.00 [0.275] COMPONENT  
EDGE-TO-EDGE SPACING, AND 0.50 [0.020]  
CLEARANCE BETWEEN VICOR HEAT SINKS.  
(B) MINIMUM RECOMMENDED PITCH IS 41.00 [1.614],  
THIS PROVIDES 8.50 [0.334] COMPONENT  
EDGE-TO-EDGE SPACING, AND 2.00 [0.079]  
CLEARANCE BETWEEN VICOR HEAT SINKS.  
3. V•I CHIP LAND PATTERN SHOWN FOR REFERENCE ONLY;  
ACTUAL LAND PATTERN MAY DIFFER.  
DIMENSIONS FROM EDGES OF LAND PATTERN  
TO PUSH-PIN HOLES WILL BE THE SAME FOR  
ALL FULL SIZE V•ICHIP PRODUCTS.  
RECOMMENDED LAND PATTERN  
(With GROUNDING CLIPS)  
TOP SIDE SHOWN  
4. RoHS COMPLIANT PER CST-0001 LATEST REVISION.  
5. UNLESS OTHERWISE SPECIFIED:  
DIMENSIONS ARE MM [INCH].  
TOLERANCES ARE:  
X.X [X.XX] = 0.3 [0.01]  
X.XX [X.XXX] = 0.13 [0.005]  
6. PLATED THROUGH HOLES FOR GROUNDING CLIPS (33855)  
SHOWN FOR REFERENCE. HEATSINK ORIENTATION AND  
DEVICE PITCH WILL DICTATE FINAL GROUNDING SOLUTION.  
Figure 17 — Hole location for push pin heat sink relative to V I Chip  
vicorpower.com 800-735-6200 V•I Chip Bus Converter BCM352F110T300A00 & BCM352T110T300A00  
Rev. 1.6  
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