PRELIMINARY
V•I Chip Bus Converter Module
Mechanical Drawings
1,00
0.039
1,00
0.039
18,00
0.709
5,9
0.23
21,5
0.85
9,00
0.354
SOLDER BALL
#A1 INDICATOR
0.020
SOLDER BALL #A1
SOLDER BALL
(106) X
Ø
0.51
1,00
0.039
TYP
30,00
1.181
32,0
1.26
28,8
1.13
C
L
15,00
0.591
16,0
0.63
C
L
1,6
0.06
1,00
0.039
TOP VIEW (COMPONENT SIDE)
BOTTOM VIEW
3,9
0.15
NOTES:
1- DIMENSIONS ARE
mm
inch
.
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON TOP SURFACE
15,6
0.62
SEATING PLANE
Figure 15—BCM BGA mechanical outline; Inboard mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
1,50
0.059
1,00
0,53
(
)
ø
PLATED VIA
0.039
0.021
CONNECT TO
INNER LAYERS
0,50
0.020
0,51
( ø
)
0.020
SOLDER MASK
DEFINED PADS
0,50
0.020
1,00
(
)
0.039
1,00
0.039
18,00
0.709
1,00
0.039
1,00
0.039
9,00
0.354
SOLDER PAD #A1
1
6,00
0.236
(4) X
10,00
0.394
(2) X
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
PCB CUTOUT
29,26
1.152
24,00
0.945
20,00
0.787
17,00
0.669
16,00
0.630
NOTES:
1- DIMENSIONS ARE
mm
inch
15,00
0.591
13,00
0.512
.
8,00
0.315
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
31
0,37
0.015
0,51
0.020
SOLDER MASK
DEFINED PAD
8,08
0.318
(106) X
ø
1,6
0.06
16,16
0.636
(4) X R
Figure 16—BCM BGA PCB land/VIA layout information; Inboard mounting
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K030T21
Rev. 1.0
Page 8 of 15
VICOR [ VICOR CORPORATION ]
