PRELIMINARY
V•I Chip Bus Converter Module
Specifications (continued)
Thermal
Symbol
Parameter
Min
Typ
130
0.61
1.1
Max
Unit
°C
Note
Over temperature shutdown
Thermal capacity
125
135
Junction temperature
BGA package
Ws/°C
°C/W
°C/W
°C/W
°C/W
RθJC
RθJB
RθJA
RθJA
Junction-to-case thermal impedance
Junction-to-BGA thermal impedance
Junction-to-ambient(1)
1.5
2.5
7.2
5.5
2.1
6.5
Junction-to-ambient(2)
5.0
Notes:
(1 B048K030T21 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) B048K030T21 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
V•I Chip Stress Driven Product Qualification Process
Test
Standard
Environment
High Temperature Operational Life (HTOL)
Temperature cycling
JESD22-A-108-B
JESD22-A-104B
JESD22-A-103A
JESD22-A113-B
EIA/JESD22-A-101-B
JESD22-A-102-C
JESD22-A-110B
JESD22-B-107-A
JESD22-B-103-A
JESD22-B-104-A
EIA/JESD22-A114-A
EIA/JESD22-A115-A
125°C, Vmax, 1,008 hrs
-55°C to 125°C, 1,000 cycles
High temperature storage
150°C, 1,000 hrs
Moisture resistance
Moisture sensitivity Level 5
Temperature Humidity Bias Testing (THB)
Pressure cooker testing (Autoclave)
Highly Accelerated Stress Testing (HAST)
Solvent resistance/marking permanency
Mechanical vibration
85°C, 85% RH, Vmax, 1,008 hrs
121°C, 100% RH, 15 PSIG, 96 hrs
130°C, 85% RH, Vmax, 96 hrs
Solvents A, B & C as defined
20g peak, 20-2,000 Hz, test in X, Y & Z directions
1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Meets or exceeds 2,000 Volts
Mechanical shock
Electro static discharge testing – human body model
Electro static discharge testing – machine model
Meets or exceeds 200 Volts
Per Vicor Internal
Test Specification(1)
Highly Accelerated Life Testing (HALT)
Operation limits verified, destruct margin determined
Per Vicor internal
test specification(1)
Dynamic cycling
Constant line, 0-100% load, -20°C to 125°C
Note:
(1) For details of the test protocols see Vicor’s website.
V•I Chip Ball Grid Array Interconnect Qualification
Test
Standard
IPC-9701
Environment
Cycle condition: TC3 (-40 to +125°C)
Test duration: NTC-B (500 failure free cycles)
BGA solder fatigue evaluation
IPC-SM-785
Solder ball shear test
IPC-9701
Failure through bulk solder or copper pad lift-off
vicorpower.com
800-735-6200
V•I Chip Bus Converter Module
B048K030T21
Rev. 1.0
Page 6 of 15
VICOR [ VICOR CORPORATION ]
