7.5-15GHz Frequency Multiplier
Chip Assembly and Mechanical Data
VG1 Voltage
VG2 Voltage
VD Voltage
CHX2193
10nF
10nF
10nF
100pF
100pF
100pF
Input / Output Bonding wires
as short as possible
Input / Output Bonding wires
as short as possible
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is to be prefered.
Bonding pad positions.
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHX21936159 - 08 Jun 06
5/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
