DC-12GHz Attenuator
CHT3091aQAG
Recommended footprint for 16L-QFN3x3
The RF ports are not DC blocked. There are no DC capacitors in the package.
SMD mounting procedure
The SMD leadless package has been designed for high volume surface mount PCB
assembly process. The dimensions and footprint required for the PCB (motherboard) are
given in the drawings above.
For the mounting process standard techniques involving solder paste and a suitable reflow
process can be used. For further details, see application note AN0005.
Ref. DSCHT3091aQAG0211 - 30 Jul 2010
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Specifications subject to change without notice
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