K-band RX
CHR2411-QDG
ESD sensitivity
Norm
MIL-STD-1686C
ESD STM5.1-1998
Value
HBM Class 1 (<1000V)
HBM Class 0 (<250V)
Package Information
Parameter
Package body material
Lead finish
MSL Rating
RoHS-compliant Low stress Injection Molded Plastic
100% matte Sn
MSL1
Recommended surface mount package assembly
(see UMS AN0017)
For volume production the SMD type package can be treated as a standard surface mount component (please refer to the
IPC/JEDEC J
-STD-020C standard or equivalent). The assembly on the motherboard can be performed using a standard
assembly process (e.g. stencil solder printing, standard pick-and-place machinery, and solder reflow oven). However, caution
should be taken to perform a good and reliable contact over the whole pad area.
MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS
300
280
260
240
217
220
200
Temperature (°C)
180
160
140
120
100
80
60
40
20
0
0
20
40
60
80
100
120
140
160
180
Time (s)
200
220
240
260
280
300
320
340
360
Maximum Ramp up rate : 3°C / second
30s Max
150
255
Attention:
The solder thickness after reflow should be typical 50µm [2 mils] and the lateral alignment between the package and the
motherboard should be within 50µm [2 mils].
It is important for the performance of the product that the whole overlapping area between the motherboard and package pads
is connected. Voids or other improper connections, in particular, between the ground pads on motherboard and package will
lead to a deterioration of the RF performance and the heat dissipation. The latter effect can reduce drastically reliability and
lifetime of the product.
Ref. : DSCHR2411QDG6174 - 23 Jun 06
7/8
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
