CHP4511
Chip Assembly and Mechanical Data
A
C
D
6-18GHz Phase-shifter
E
Out/In 1
In/Out
Out/In 2
A
B
E
Note : 25µm diameter gold wire is recommended
Bonding pad positions.
(Chip thickness : 100µm.all dimensions are in micrometers)
Ref. : DSCHP45116216 - 04 Aug 06
6/8
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09