CHA7012
X-band High Power Amplifier
Chip Mechanical Data and Pin references
2 3 4
5
6
7
8 9 10
11
22 21 20
19 18
17
16 15 14
13
Chip thickness = 100µm +/- 10 µm
RF pads (1, 12) = 96 x 196µm²
DC pads (2, 3, 4, 5, 9,15, 19, 20, 21, 22) = 96 x 96µm²
DC pads (7, 17) = 192 x 96µm²
DC pads (11, 13) = 288 x 96µm²
Pin number
1
8, 16
5, 9, 15, 19
2, 22
4, 20
6, 10, 14, 18
3, 7, 11, 13, 17, 21
12
Pin name
IN
Vctrl
TI
TO
GND
V,Vc1,Vc2
OUT
Description
Input RF
NC
Collector current control voltage
TTL input
TTL output
Ground (NC)
Power supply voltage
Output RF
Ref. : DSCHA70127235 - 23 Aug 07
8/10
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
