CHA6042
13-16GHz High Power Amplifier
MMIC Outline & Bond Pads
Not to scale, dimensions are in millimeters
2
3
4
5
1
1.36
±0.35
6
1
9
8
7
2.34
±0.35
Bond Pad
1
2
3
4
5
6
7
8
9
10
Symbol
x-dim.
y-dim.
x-center
y-center
RF input
Vd1
Vd2
Vd3
Vd4
RF output
Vg4
Vg3
Vg2
Vg1
(um)
100
100
100
150
200
100
100
100
100
100
(um)
200
100
100
100
100
200
100
100
100
100
(um)
115
305
470
1280
1775
2235
1630
1310
920
525
(um)
835
1255
1255
1255
1255
785
105
105
105
105
Chip size : 2340µm +/-35µm x 1360µm +/- 35µm
Ref. : DSCHA6042218 - 06-Aug.-02
4/6
Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
