CHA5197A 参数 Datasheet PDF下载

CHA5197a

21-26.5GHz Medium Power Amplifier

Bonding pad positions.

( Chip thickness : 70µm. All dimensions are in micrometers )

Ordering Information

Chip form

:

CHA5197a98F/00

Information furnished is believed to be accurate and reliable. However

United Monolithic Semiconductors

S.A.S.

assumes no responsibility for the consequences of use of such information nor for any infringement of

patents or other rights of third parties which may result from its use. No license is granted by implication or

otherwise under any patent or patent rights of

United Monolithic Semiconductors S.A.S..

Specifications

mentioned in this publication are subject to change without notice. This publication supersedes and replaces all

information previously supplied.

United Monolithic Semiconductors S.A.S.

products are not authorised for use

as critical components in life support devices or systems without express written approval from

United Monolithic

Semiconductors S.A.S.

Ref. DSCHA5197a7173 - 22 Jun 07

6/6

Specifications subject to change without notice

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