7-20GHz Amplifier
Chip Assembly and Mechanical Data
DC drain supply feed
CHA3667a
10nF
120pF
Vd
OUT
IN
Note
: 25µm diameter gold wire is to be prefered.
DC Pad size : 86/83µm .
RF Pad size: 105/171 m
RF wire bondings should be as short as possible, lower than 0.35mm.
Chip thickness: 100µm ±.10 m
Bonding pad position
Ref. : DSCHA3667a7296 - 23 Oct 07
7/8
Specifications subject to change without notice
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