20-40GHz Medium Power Amplifier
Chip Assembly and Mechanical Data
CHA3093c
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions.
( Chip thickness : 100µm.all dimensions are in micrometers)
Number
1
2
3
4
Size (x,y) µm
34 / 98
48 / 68
98 / 34
34 / 98
Center position (x,y) µm
(Refered to bottom left origin)
773 / 689
68 /34
800 / 43
1237/ 73
Pickup Pillow
Ref. : DSCHA30932158 -07-June-02
9/10
Specifications subject to change without notice
United Monolithic Semiconductors S.A.S.
Route Départementale 128 - B.P.46 - 91401 Orsay Cedex France
Tel. : +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
