CHA3023
1-18 GHz Wide Band Amplifier
Chip Assembly and Mechanical Data
Special care should be taken concerning the biasing procedure. Apply Vg before Vd.
Equivalent wire
bonding : 0.15 nH
Equivalent wire
bonding : 0.15 nH
The CHA3023 could be used without Vg2 bias. There is a resistor bridge inside the chip. This
one generates the correct value of Vg2 Bias. Pads G2a and G2 must be connected.
Equivalent RF Wire Bondings: 0.15 nH (typical length of 200µm for a 25µm diameter wire).
Equivalent wire
bonding : 0.15 nH
Equivalent wire
bonding : 0.15 nH
DSCHA30235263 - 20 sep 05
7/8
Specifications subject to change without notice
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Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
UMS [ UNITED MONOLITHIC SEMICONDUCTORS ]
