CHA2098RBF
20-33GHz High Gain Buffer Amplifier
The RF ports comprise a DC blocking capacitor on chip level. The DC connections
include a first level of DC decoupling capacitors (typically 120pF) in the package.
However, all DC bias ports should be additionally connected to ground with 10nF
capacitors at board level to prevent the MMIC from oscillations. These parts should
be placed close to the SMD leadless package. If the same bias is required at
different DC ports, the lines should only be connected behind these block capacitors.
Further information on the application of the SMD leadless packages for GaAs
monolithic microwave ICs are given in the UMS Application Note AN0005.
Ordering Information
SMD leadless package form :
CHA2098RBF/24
Information furnished is believed to be accurate and reliable. However
United Monolithic Semiconductors
S.A.S.
assumes no responsability for the consequences of use of such information nor for any infringement of
patents or other rights of third parties which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of
United Monolithic Semiconductors S.A.S..
Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.
United Monolithic Semiconductors S.A.S.
products are not authorised for use
as critical components in life support devices or systems without express written approval from
United
Monolithic Semiconductors S.A.S.
Ref. : DSCHA2098RBF2057 -26-Feb.-02
6/6
Specifications subject to change without notice
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