TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Application Circuit
PC Board Layout
Top RF layer is 0.008” thick Roger RO4003, єr = 3.38. Microstrip 50Ω line detail: width =0.0175”. For further
technical information, refer to the TGV2529-SM Product Information page.
The pad pattern shown has been developed and tested for optimized assembly at Triquint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerance. Since surface mount
processes vary from company to company, careful process development is recommended.
Top layer
1 oz Cu
Roger 4003 0.008"
GND layer
1/2 oz Cu
0.062"
FR4
1 oz Cu
Bottom layer
Bill of Material
Ref Des
C1
Value Description
100 pF Ceramic Cap, 0402
1 µF Ceramic Cap, 0603
Manufacturer
various
Part Number
C2
various
C3
10 µF Tantalum Cap, 0805/1206
0 ohm Chip Res, 0402
various
R1, R2
various
Data Sheet: RevA 12/12/12
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Disclaimer: Subject to change without notice
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