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TGV2529-SM 参数 Datasheet PDF下载

TGV2529-SM图片预览
型号: TGV2529-SM
PDF下载: 下载PDF文件 查看货源
内容描述: 12.5 ???? 13.5 GHz的VCO与2分频 [12.5 – 13.5 GHz VCO with Divide by 2]
分类和应用:
文件页数/大小: 14 页 / 861 K
品牌: TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
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TGV2529-SM  
12.5 13.5 GHz VCO with Divide by 2  
Application Circuit  
PC Board Layout  
Top RF layer is 0.008” thick Roger RO4003, єr = 3.38. Microstrip 50Ω line detail: width =0.0175”. For further  
technical information, refer to the TGV2529-SM Product Information page.  
The pad pattern shown has been developed and tested for optimized assembly at Triquint Semiconductor. The  
PCB land pattern has been developed to accommodate lead and package tolerance. Since surface mount  
processes vary from company to company, careful process development is recommended.  
Top layer  
1 oz Cu  
Roger 4003 0.008"  
GND layer  
1/2 oz Cu  
0.062"  
FR4  
1 oz Cu  
Bottom layer  
Bill of Material  
Ref Des  
C1  
Value Description  
100 pF Ceramic Cap, 0402  
1 µF Ceramic Cap, 0603  
Manufacturer  
various  
Part Number  
C2  
various  
C3  
10 µF Tantalum Cap, 0805/1206  
0 ohm Chip Res, 0402  
various  
R1, R2  
various  
Data Sheet: RevA 12/12/12  
- 9 of 14 -  
Disclaimer: Subject to change without notice  
Connecting the Digital World to the Global Network®  
© 2012 TriQuint Semiconductor, Inc.