TGV2529-SM
12.5 – 13.5 GHz VCO with Divide by 2
Mechanical Information
PCB Mounting Pattern
All dimensions are in millimeters [inches].
Notes:
1.The pad pattern shown has been developed and tested for optimized assembly at TriQuint Semiconductor. The
PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount
processes vary from company to company, careful process development is recommended.
2.Ground / thermal vias are critical for the proper performance of this device. Vias have a final plated thru diameter
of .25 mm (.010”).
Data Sheet: RevA 12/12/12
- 11 of 14 -
Disclaimer: Subject to change without notice
Connecting the Digital World to the Global Network®
© 2012 TriQuint Semiconductor, Inc.
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
