TGF2960-SD
Table IV
Power Dissipation and Thermal Properties
Parameter
Test Conditions
Value
Maximum Power Dissipation
Tbaseplate = 70°C
Pd = 1.37 W
Tchannel = 175°C
Tm = 8.77E+06 Hrs
Thermal Resistance, θjc
Vd = 8 V
θjc = 77 (°C/W)
Tchannel = 146.5°C
Tm = 2.06E+08 Hrs
Id = 100 mA
Pd = 0.8 W
Tbaseplate = 85°C
Thermal Resistance, θjc
Vd = 8 V
θjc = 77 (°C/W)
Tchannel = 126°C
Tm = 2.48E+09 Hrs
at Psat
Id =130 mA
Pout = 27 dBm
Pd = 0.54 W
Tbaseplate = 85°C
Mounting Temperature
Storage Temperature
See ‘Typical Solder Reflow Profiles’ Table
-65 to 150°C
5
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2012 © Rev B
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
