TGF2960-SD
Recommended Surface Mount Package Assembly
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Typical Solder Reflow Profiles
Reflow Profile
SnPb
Pb Free
Ramp-up Rate
3 °C/sec
3 °C/sec
Activation Time and
Temperature
60 – 120 sec @ 140 – 160 °C
60 – 150 sec
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
Time above Melting Point
Max Peak Temperature
240 °C
260 °C
Time within 5 °C of Peak
10 – 20 sec
10 – 20 sec
Temperature
Ramp-down Rate
4 – 6 °C/sec
4 – 6 °C/sec
Ordering Information
Part
Package Style
SOT-89, TAPE AND REEL
TGF2960-SD, TAPE AND REEL
21
TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com
May 2012 © Rev B
TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
