Advance Product Datasheet
April 6, 2006
TGA4819-SL
TABLE I
MAXIMUM RATINGS
Symbol
VD
VG
VCTRL
ID
Parameter
Value
9 V
-3V to 0V
-3V to VD/2
400 mA
5 mA
Notes
1/ 2/
1/
1/
1/ 2/
1/
1/ 2/
1/ 2/
1/ 2/ 3/
4/
Drain Voltage
Gate Voltage Range
Control Voltage Range
Drain Supply Current (Quiescent)
Gate Supply Current
Input Continuous Wave Power
10.7Gb/s PRBS Input Voltage
Power Dissipation
Operating Channel Temperature
Mounting Temperature
(10 Seconds)
| IG |
PIN
VIN
PD
TCH
TM
23 dBm
4 VPP
3.1 W
150 0C
230 0C
TSTG
Storage Temperature
-65 to 150 0C
1/ These ratings represent the maximum operable values for this device
2/ Combinations of supply voltage, supply current, input power, and output power shall not
exceed PD at a package base temperature of 70 C
°
3/ When operated at this bias condition with a baseplate temperature of 70 C, the MTTF is
°
reduced to 1.0E+6 hours
4/ Junction operating temperature will directly affect the device median time to failure
(MTTF). For maximum life, it is recommended that junction temperatures be maintained
at the lowest possible levels.
TABLE II
THERMAL INFORMATION
Parameter
Test Conditions
TCH
MTTF
(hrs)
RΘJC
(°C)
(°C/W)
VD = 8V
R
ΘJC Thermal Resistance
ID = 350mA
142.8
25.7
1.9E6
(Channel to Backside of
Package)
P
T
DISS = 2.8W
BASE = 70°C
Note: Thermal transfer is conducted through the bottom of the TGA4819-SL
package into the motherboard. The motherboard must be designed to
assure adequate thermal transfer to the base plate.
2
TriQuint Semiconductor Texas : (972)994 8465 Fax (972)994 8504 Web: www.triquint.com
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