Preliminary
QPC7336
PCB Metal Land Pattern (Dimensions in millimeters)
Notes:
1. All dimensions are in millimeters. Angles are in degrees.
2. Use 2 oz. copper minimum for top and bottom layer metal.
3. Vias are required under the backside paddle of this device for proper RF/DC grounding and thermal dissipation. We recommend a 0.35mm
(#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25mm (0.10”).
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.
Data Sheet Rev.B, August 2, 2017 | Subject to change without notice
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TRIQUINT [ TRIQUINT SEMICONDUCTOR ]
