QPB1500
Ku-Band 25 W GaN Power Amplifier
Assembly Notes
1. Clean the board or module with alcohol. Allow it to dry fully.
2. Screws are recommended for mounting the QPB1500 to the T-Carrier.
3. To improve the thermal and RF performance, we recommend the following:
a. Apply 4ꢀmils indium shim or thermal compound between the package and the T-Carrier.
b. Attach a heat sink to the bottom of the T-Carrier and apply 4ꢀmils indium shim or thermal compound
between the heat sink and the T-Carrier.
4. Apply solder to each pin of the QPB1500.
5. Clean the assembly with alcohol.
Mechanical Information
Units: inches
Tolerances: (unless specified)
x.xx = 0.01
x.xxx = 0.005
Materials:
Base: Copper
Leads: Alloy 194
Lid: LCP (liquid crystal polymer)
All metalized features are gold plated
Part is epoxy sealed
Marking:
QPB1500: Part number
YY: Part Assembly year
WW: Part Assembly week
ZZZ: Serial Number (unique for all parts within one assembly lot)
MXXX: Batch ID
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Data Sheet Rev. A, June 26, 2017
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