QPA2735
13.75 –ꢀ18ꢀGHz GaAs Low Noise Amplifier
Evaluation Board and Assembly
RF Layer is 0.008” thick Rogers Corp. RO4003C (εr = 3.35). Metal layers are 0.5 oz. copper. The microstrip line at
the connector interface is optimized for the Southwest Microwave end launch connector 1492-04A-5.
The evaluation board PCB used the same design as that of QPA2626.
All data de-embedded to the device reference plane (shown).
Bill of Materials
Ref. Des. Component
Value
Manuf. Part Number
C3, C12
C6, C15
C9, C18
Surface Mount Cap. CAP 0.01UF +/-10% 50V 0402 X7R ROHS
Various
Surface Mount Cap. CAP 1.0UF +/-10% 16V 0603 X7R ROHS
Various
Surface Mount Cap. CAP CER 10UF 10V X7R 10% 0805 TDK ROHS Various
Data Sheet Rev. A, June 12 10, 2017 | Subject to change without notice
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