TAA2008 参数 Datasheet PDF下载

Tri path Technol og y, I nc. - Techni cal I nformation

A B S O L U T E M A X I M U M R A T I N G S

(Note 1)

SYMBOL

V

DD

V5

SLEEP

MUTE

T

STORE

T

A

T

J

ESD

HB

ESD

MM

Supply Voltage

Input Section Supply Voltage

SLEEP Input Voltage

MUTE Input Voltage

Storage Temperature Range

Operating Free-air Temperature Range

Junction Temperature

ESD Susceptibility – Human Body Model (Note 2)

ESD Susceptibility – Machine Model (Note 3)

PARAMETER

Value

16

6.0

-0.3 to 6.0

-0.3 to V5+0.3

-40 to 150

0 to 70

150

2000

200

UNITS

V

V

V

V

°C

°C

°C

V

V

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.

Note 2: Human body model, 100pF discharged through a 1.5KΩ resistor.

Note 3: Machine model, 220pF – 240pF discharged through all pins.

O P E R A T I N G C O N D I T I O N S

(Note 4)

SYMBOL

V

DD

V

IH

V

IL

Supply Voltage (Note 5)

High-level Input Voltage (MUTE, SLEEP)

Low-level Input Voltage (MUTE, SLEEP)

PARAMETER

MIN.

8.5

3.5

1

TYP.

12

MAX.

14.0

UNITS

V

V

V

Note 4: Recommended Operating Conditions indicate conditions for which the device is functional. See

Electrical Characteristics for guaranteed specific performance limits.

Note 5: Operation above 13.2V requires the use of low and high side schottky diodes as well as 220uF for

C

SW

. See the Application Section for additional information

THERMAL CHARACTERISTICS

SYMBOL

θ

JA

PARAMETER

Junction-to-ambient Thermal Resistance (note 6)

VALUE

22

UNITS

°C/W

Note 6: The

θ

JA

value is based on the exposed pad being soldered down to the printed circuit board. The

exposed pad must be soldered to an exposed copper area on the printed circuit board for proper thermal

and electrical performance.

2

TAA2008 –KLi/1.0/05.06