TMC5031 DATASHEET (Rev. 1.11 / 2016-APR-28)
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17.3 Thermal Characteristics
The following table shall give an idea on the thermal resistance of the QFN-48 package. The thermal
resistance for a four layer board will provide a good idea on a typical application. The single layer
board example is kind of a worst case condition, as the typical application will require a 4 layer
board. Actual thermal characteristics will depend on the PCB layout, PCB type and PCB size.
A thermal resistance of 23°C/W for a typical board means, that the package is capable of continuously
dissipating 4W at an ambient temperature of 25°C with the die temperature staying below 125°C.
Parameter
Symbol Conditions
Typ
Unit
Typical power dissipation
PD
One motor 1.00A RMS 112°C (120°C)
3.5
2.3
W
W
One motor active, one motor in
standby at low current
One motor 0.71A RMS 83°C (90°C)
Surface temperature at package center
(peak surface temperature), board
55mm x 85mm, 25°C environment
stealthChop or spreadCycle, sinewave,
20kHz chopper, 16V, 16MHz, internal
supply for VCC
Motors: QSH4218-035-10-027
Typical power dissipation
Two motors active
PD
Two motors 0.71A RMS 110°C (114°C)
Two motors 0.35A RMS 64°C (65°C)
3.5
1.3
W
W
Thermal resistance junction to
ambient on a single layer board
RTJA
Single signal layer board (1s) as
defined in JEDEC EIA JESD51-3
(FR4, 76.2mm x 114.3mm, d=1.6mm)
80
K/W
Thermal resistance junction to
ambient on a multilayer board
RTMJA
Dual signal and two internal power
plane board (2s2p) as defined in
JEDEC EIA JESD51-5 and JESD51-7
(FR4, 76.2mm x 114.3mm, d=1.6mm)
23
K/W
Thermal resistance junction to
ambient on a multilayer board
with air flow
RTMJA1
Identical to RTMJA, but with air flow
1m/s
20
K/W
Thermal resistance junction to
board
RTJB
RTJC
PCB temperature measured within
1mm distance to the package
10
3
K/W
K/W
Thermal resistance junction to
case
Junction temperature to heat slug of
package
The thermal resistance in an actual layout can be tested by checking for the heat up caused by the
standby power consumption of the chip. When no motor is attached, all power seen on the power
supply is dissipated within the chip.
Note:
A spread-sheet for calculating TMC5031 power dissipation is available on www.trinamic.com.
www.trinamic.com
TRINAMIC [ TRINAMIC MOTION CONTROL GMBH & CO. KG. ]
