TS9002
PACKAGE OUTLINE DRAWING
8-Pin MSOP Package Outline Drawing
(N.B., Drawings are not to scale)
3.10 Max
2.90 Min
0.38 Max
0.28 Min
0.65 REF
8
0.23 Max
0.13 Min
0.127
0.27 REF
3.10 Max
2.90 Min
5.08 Max
4.67 Min
GAUGE PLANE
0' -- 6'
1
2
0.70 Max
0.40 Min
0.25
0.38 Max
0.28 Min
DETAIL “A”
DETAIL ‘A’
0.95 Max
0.75 Min
SEATING PLANE
0.15 Max
0.05 Min
1.10 Max
0.10 Max
0.23 max
0.13 Min
NOTE:
1. PACKAGE LENGTH DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
2. PACKAGE WIDTH DOES NOT INCLUDE INTERLEAD FLASH OR PROTUSIONS.
3. CONTROLLING DIMENSION IN MILIMETERS.
4. THIS PART IS COMPLIANT WITH JEDEC MO-187 VARIATIONS AA
5. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED AS SPECIAL CHARACTERISTIC.
Information furnished by Touchstone Semiconductor is believed to be accurate and reliable. However, Touchstone Semiconductor does not
assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
Touchstone Semiconductor reserves the right to change product specifications and product descriptions at any time without any advance
notice. No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone
Semiconductor assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using Touchstone Semiconductor components. To minimize the risk associated with customer products and applications,
customers should provide adequate design and operating safeguards. Trademarks and registered trademarks are the property of their
respective owners.
Touchstone Semiconductor, Inc.
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630 Alder Drive, Milpitas, CA 95035
+1 (408) 215 - 1220 ▪ www.touchstonesemi.com
TS9002DS r1p0
RTFDS
TOUCHSTONE [ TOUCHSTONE SEMICONDUCTOR INC ]
