TS9001
PACKAGE OUTLINE DRAWING
5-Pin SC70 Package Outline Drawing
(N.B., Drawings are not to scale)
0.65 TYP.
2
0.15 - 0.30
5
1
4
3
1.80 - 2.40
2
1.30 TYP.
1.80 - 2.20
8º - 12º ALL
SIDE
1
0.800 – 0.925
0.40 – 0.55
LEAD FRAME THICKNESS
0.10 - 0.18
0.15
TYP.
1.00
MAX
GAUGE PLANE
1.15 - 1.35
0º - 8º
0.00 - 0.10
0.10 MAX
0.26 - 0.46
0.275 - 0.575
NOTES:
1
DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
DOES NOT INCLUDE INTER-LEAD FLASH OR PROTRUSIONS.
2
3. DIE IS FACING UP FOR MOLDING. DIE IS FACING DOWN FOR TRIM/FORM.
4
ALL SPECIFICATION COMPLY TO JEDEC SPEC MO-203 AA
5. CONTROLLING DIMENSIONS IN MILIMITERS.
6. ALL SPECIFICATIONS REFER TO JEDEC MO-203 AA
7. LEAD SPAN/STAND OFF HEIGHT/COPLANARITY ARE CONSIDERED AS SPECIAL CHARACTERISTIC
Information furnished by Touchstone Semiconductor is believed to be accurate and reliable. However, Touchstone Semiconductor does not
assume any responsibility for its use nor for any infringements of patents or other rights of third parties that may result from its use, and all
information provided by Touchstone Semiconductor and its suppliers is provided on an AS IS basis, WITHOUT WARRANTY OF ANY KIND.
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No license is granted by implication or otherwise under any patent or patent rights of Touchstone Semiconductor. Touchstone Semiconductor
assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using
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TS9001DS r1p0
RTFDS
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