TLP759(IGM)
·
Option (D4) type
VDE approved: DIN VDE0884 / 06.92,
Maximum operating insulation voltage: 890V
PK
Highest permissible over voltage: 6000V
PK
(Note 1) When a VDE0884 approved type is needed,
please designate the “Option (D4)”
·
Structural parameter
7.62mm pich TLP759 (IGM)
Creepage distance: 7.0mm (min.)
Clearance: 7.0mm (min.)
Insulation thickness: 0.4mm (min.)
Maximum Ratings (Ta = 25°C)
Characteristic
Symbol
Rating
Unit
Forward current
(Note 2)
(Note 3)
(Note 4)
I
25
50
mA
mA
A
F
Pulse forward current
I
FP
Peak transient forward current
Reverse voltage
I
1
FPT
V
P
5
V
R
D
Diode power dissipation
Output current
(Note 5)
45
mW
mA
mA
V
I
8
O
Peak output current
I
16
OP
Output voltage
V
-0.5~20
-0.5~30
100
O
supply voltage
V
T
V
CC
Output power dissipation
Operating temperature range
Storage temperature range
Lead solder temperature(10s)
Isolation voltage(AC,1min.,R.H.≤60%,Ta=25°C)
(Note 6)
P
mW
°C
°C
°C
O
-55~100
-55~125
260
opr
T
T
stg
(Note 7)
(Note 8)
sol
BV
5000
V
rms
S
(Note 2): Derate 0.8mA above 70°C.
(Note 3): 50% duty cycle,1ms pulse width.
Derate 1.6mA / °C above 70°C.
(Note 4): Pulse width PW ≤ 1µs,300pps.
(Note 5): Derate 0.9mW / °C above 70°C.
(Note 6): Derate 2mW / °C above 70°C.
(Note 7): Soldering portion of lead: Up to 2mm from the body of the device.
(Note 8): Device considerd a two terminal device: Pins 1, 2, 3 and 4 shorted together and
pins 5, 6, 7 and 8 shorted together.
2
2003-02-19
TOSHIBA [ TOSHIBA ]
