XC8107
Series
■PACKAGING INFORMATION (Continued)
●
USP-6C Power Dissipation
Power dissipation data for the USP-6C is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
Material: Glass Epoxy (FR-4)
Thickness: 1.6mm
Through-hole 4 x 0.8 Diameter
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
Thermal Resistance (℃/W)
25
1000
200
100.00
105
Pd vs. Ta
Pd-Ta特性グラフ
1200
1000
800
600
400
200
0
25
45
65
85
105
125
周囲温度Ta（℃）
Ambient Temperature: Ta (℃)
25/27
TOREX [ Torex Semiconductor ]
