XC8107 Series
■PACKAGING INFORMATION (Continued)
●
SOT-25 Power Dissipation
Power dissipation data for the SOT-25 is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
40.0
28.9
Condition: Mount on a board
Ambient: Natural convection
Soldering: Lead (Pb) free
Board: Dimensions 40 x 40 mm (1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board area
In top and back faces
Package heat-sink is tied to the copper traces
(Board of SOT-26 is used)
Material: Glass Epoxy (FR-4)
Thickness: 1.6mm
Through-hole 4 x 0.8 Diameter
1.4
2.54
Evaluation Board (Unit: mm)
2. Power Dissipation vs. Ambient Temperature (105℃)
Board Mount (Tjmax=125℃)
Ambient Temperature (℃)
Power Dissipation Pd (mW)
Thermal Resistance (℃/W)
25
600
120
166.67
105
Pd vs. Ta
Pd-Ta特性グラフ
700
600
500
400
300
200
100
0
25
45
65
85
105
125
周囲温度Ta（℃）
Ambient Temperature: Ta (℃)
24/27
TOREX [ Torex Semiconductor ]
