UCC27323, UCC27324, UCC27325
UCC37323, UCC37324, UCC37325
SLUS492H –JUNE 2001–REVISED MAY 2013
www.ti.com
D, DGN, OR P PACKAGE
(TOP VIEW)
ORDERING INFORMATION(1)
OUTPUT CONFIGURATION
TEMPERATURE
PACKAGED DEVICES
RANGE
TA = TJ
SOIC-8 (D)
MSOP-8 PowerPAD
(DGN)(2)
PDIP-8 (P)
Dual inverting
Dual nonInverting
–40°C to +125°C
0°C to +70°C
UCC27323D
UCC37323D
UCC27324D
UCC37324D
UCC27325D
UCC37325D
UCC27323DGN
UCC37323DGN
UCC27324DGN
UCC37324DGN
UCC27325DGN
UCC37325DGN
UCC27323P
UCC37323P
UCC27324P
UCC37324P
UCC27325P
UCC37325P
–40°C to +125°C
0°C to +70°C
One inverting, one noninverting
–40°C to +125°C
0°C to +70°C
(1) D (SOIC-8) and DGN (PowerPAD-MSOP) packages are available taped and reeled. Add R suffix to device type (for example
UCC27323DR, UCC27324DGNR) to order quantities of 2,500 devices per reel for D or 1,000 devices per reel for DGN package.
(2) The PowerPAD is not directly connected to any leads of the package. However, the PowerPAD is electrically and thermally connected to
the substrate which is the ground of the device.
POWER DISSIPATION RATINGS
PACKAGE
SUFFIX
θJC (°C/W)
θJA (°C/W)
Power Rating (mW)
TA = 70°C(1)
Derating Factor
Above 70°C
(mW/°C)(1)
SOIC-8
PDIP-8
D
P
42
49
84 to 160(2)
110
344 to 655(3)
500
6.25 to 11.9(3)
9
MSOP PowerPAD-8(2)
DGN
4.7
50 to 59(2)
1370
17.1
(1) 125°C operating junction temperature is used for power rating calculations.
(2) The PowerPAD is not directly connected to any leads of the package. However, it is electrically and thermally connected to the substrate
which is the ground of the device.
(3) The range of values indicates the effect of pc-board. These values are intended to give the system designer an indication of the best
and worst case conditions. In general, the system designer should attempt to use larger traces on the pc-board where possible in order
to spread the heat away form the device more effectively. For information on the PowerPAD package, refer to Technical Brief,
PowerPad Thermally Enhanced Package, Texas Instrument's Literature Number SLMA002, and Application Brief, PowerPad Made
Easy, Texas Instruments Literature Number SLMA004.
Table 1. INPUT/OUTPUT TABLE
INPUTS (VIN_L, VIN_H)
UCC37323
UCC37324
UCC37325
INA
L
INB
L
OUTA
OUTB
OUTA
OUTB
OUTA
OUTB
H
H
L
H
L
L
L
L
H
L
H
H
L
L
H
L
L
H
H
L
H
L
H
H
H
H
L
H
L
H
2
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