SCES640C – JANUARY 2007 – REVISED MAY 2009
www.ti.com
Table 1. ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP
–40°C to 85°C
SSOP – DCT
VSSOP – DCU
(1)
(2)
(3)
(2)
ORDERABLE PART NUMBER
Reel of 3000
Reel of 3000
Reel of 250
Reel of 3000
TXS0102YZPR
TXS0102DCTR
TXS0102DCTT
TXS0102DCUR
TOP-SIDE MARKING
(3)
2H_
NFE_ _ _
NFE _ _ _
NFE_
Package drawings, thermal data, and symbolization are available at
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
DCT: The actual top-side marking has three additional characters that designate the year, month, and wafer fab/assembly site.
DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
PIN DESCRIPTION
NO.
DCT,
DCU
1
2
3
4
5
6
7
8
YZP
A1
B1
C1
D1
D2
C2
B2
A2
NAME
B2
GND
V
CCA
A2
A1
OE
V
CCB
B1
TYPE
I/O
GND
PWR
I/O
I/O
Input
PWR
I/O
Input/output B. Referenced to V
CCB
.
Ground
A-port supply voltage. 1.65 V
≤
V
CCA
≤
3.6 V and V
CCA
≤
V
CCB
Input/output A. Referenced to V
CCA
.
Input/output A. Referenced to V
CCA
.
Output enable (active High). Pull OE low to place all outputs in 3-state mode.
Referenced to V
CCA
.
B-port supply voltage. 2.3 V
≤
V
CCB
≤
5.5 V
Input/output B. Referenced to V
CCB
.
FUNCTION
TYPICAL OPERATING CIRCUIT
1.8 V
0.1
mF
0.1
mF
1
mF
3.3 V
1.8 V
System
Controller
V
CCA
OE
V
CCB
3.3 V
System
Data
A1
A2
B1
B2
Data
2
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