TXB0302
SCES837A –MARCH 2012–REVISED MAY 2012
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
PIN DESCRIPTION
PIN NO.
NAME
FUNCTION
DQM
TXB0302
1
2
3
4
5
6
7
8
VCCA
A1
A-port supply voltage 0.9 V ≤ VCCA ≤ 3.6 V
Input/output 1. Referenced to VCCA
Input/output 2. Referenced to VCCA
Ground
.
.
A2
GND
OE
3-state output-mode enable. Pull OE (TXB0302) low to place all outputs in 3-state mode.
B2
Input/output 2. Referenced to VCCB
Input/output 1. Referenced to VCCB
.
.
B1
VCCB
B-port supply voltage 0.9 V ≤ VCCB ≤ 3.6 V.
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
–0.5
–0.5
-0.5
MAX
4.6
4.6
4.6
6.5
4.6
6.5
UNIT
VCCA
V
Supply voltage range
VCCB
A port
B port
A port
B port
A port
B port
VI < 0
VO < 0
V
V
V
VI
Input voltage range
Voltage range applied to any output in the high-impedance or
power-off state
VO
VO
–0.5 VCCA + 0.5
Voltage range applied to any output in the high or low state(2)
–0.5 VCCB + 0.5
IIK
IOK
IO
Input clamp current
–50
–50
mA
mA
mA
mA
°C
Output clamp current
Continuous output current
±50
Continuous current through VCCA, VCCB, or GND
Storage temperature range
±100
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL IMPEDANCE RATINGS(1)(2)
TXB0302
THERMAL METRIC
DQM
8 PINS
259
UNIT
θJA
Package thermal impedance
°C/W
(1) The package thermal impedance is calculated in accordance with JESD 51-7.
(2) The package thermal impedance is calculated in accordance with JESD 51-5.
2
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