PACKAGE/ORDERING INFORMATION
(1)
MAXIMUM
MAXIMUM
RELATIVE ACCURACY GAIN ERROR
(LSB)
(LSB)
±2
±4
PACKAGE
DESIGNATOR
PW
SPECIFIED
TEMPERATURE
RANGE
–40°C to +85°C
PACKAGE
MARKING
TSC2003I
ORDERING
NUMBER
TSC2003IPW
TSC2003IPWR
TSC2003IZQCR
TRANSPORT
MEDIA, QUANTITY
Tube, 94
Tape and Reel, 2500
Tape and Reel, 2500
PRODUCT
TSC2003
PACKAGE-LEAD
TSSOP-16
"
TSC2003
"
±2
"
±4
"
VFBGA-48
"
ZQC
"
–40°C to +85°C
"
BC2003
NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this data sheet.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
+V
DD
to GND ........................................................................ –0.3V to +6V
Digital Input Voltage to GND ................................. –0.3V to +V
DD
+ 0.3V
Analog Input Voltage to GND. All Pins Except 7, 8 ...... –0.3V to +V
DD
+ 0.3V
Analog Input Voltage Pins 7, 8 to GND ........................... –0.3V to +6.0V
Operating Temperature Range ........................................ –40°C to +85°C
Storage Temperature Range ......................................... –65°C to +150°C
Power Dissipation .......................................................... (T
J
Max – T
A
)/
θ
JA
TSSOP Package
Junction Temperature (T
J
Max) .............................................. +150°C
θ
JA
Thermal Impedance ................................................... +115.2°C/W
Lead Temperature, Soldering
Vapor Phase (60s) ............................................................ +215°C
Infrared (15s) ..................................................................... +220°C
VFBGA Package
Junction Temperature (T
J
Max) .............................................. +125°C
PIN CONFIGURATION
Top View
+V
DD
X+
Y+
X–
Y–
GND
V
BAT1
V
BAT2
1
2
3
4
5
6
7
8
TSC2003
16
15
14
13
12
11
10
9
IN1
IN2
A0
A1
SCL
SDA
TSSOP
θ
JA
Thermal Impedance ........................................................ +50°C/W
Lead Temperature, Soldering
Vapor Phase (60s) ............................................................ +215°C
Infrared (15s) ..................................................................... +220°C
NOTE: (1) Stresses above those listed under
Absolute Maximum Ratings
may
cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
PIN DESCRIPTIONS
TSSOP VFBGA
PIN #
1
2
3
PIN #
C1, D1
E1
F1
G1
G2
G3, G4
G5
G6
B7
A7
A6
A4
A3
A2
A1
B1
NAME
+V
DD
X+
Y+
X–
Y–
GND
V
BAT1
V
BAT2
V
REF
PENIRQ
SDA
SCL
A1
A0
IN2
IN1
DESCRIPTION
Power Supply
X+ Position Input
Y+ Position Input
X– Position Input
Y– Position Input
Ground
Battery Monitor Input
Battery Monitor Input
Voltage Reference Input/Output
Pen Interrupt. Open Drain Output (Requires
30kΩ to 100kΩ pull-up resistor externally).
Serial Data
Serial Clock
I
2
C Bus Address Input A1
I
2
C Bus Address Input A0
Auxiliary A/D Converter Input
Auxiliary A/D Converter Input
PENIRQ
V
REF
Top View
A0
A1
SCL
SDA PENIRQ
VFBGA
4
5
1
A
2
3
4
5
NC
6
7
6
7
8
IN2
B
IN1
C
+V
DD
D
+V
DD
E
X+
F
Y+
G
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
V
REF
9
10
11
12
13
14
15
16
X−
Y−
GND
GND
V
BAT1
V
BAT2
NC = No Connection
2
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TSC2003
SBAS162D
TI [ TEXAS INSTRUMENTS ]
