PACKAGE OUTLINE
DCP0038A
PowerPADTM TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
0
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
TYP
A
0.1 C
PIN 1 INDEX
AREA
SEATING
PLANE
36X 0.5
38
1
2X
9
9.8
9.6
NOTE 3
19
20
0.27
0.17
0.08
38X
4.5
4.3
B
C A B
SEE DETAIL A
(0.15) TYP
2X 0.95 MAX
NOTE 5
19
20
2X 0.95 MAX
NOTE 5
0.25
GAGE PLANE
1.2 MAX
39
4.70
3.94
THERMAL
PAD
0.15
0.05
0.75
0.50
0 -8
A
20
DETAIL A
TYPICAL
1
38
2.90
2.43
4218816/A 10/2018
PowerPAD is a trademark of Texas Instruments.
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
5. Features may differ or may not be present.
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