SNVS856B – JUNE 2012 – REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
VCC to GND
DLY,COMP,ZCD to GND
ISNS to GND
GATE to GND
ESD Susceptibility: HBM
(2)
(1)
VALUE / UNITS
–0.3V to 40V
–0.3V to 7V
–0.3V to 7V
(5ns,-6V) -0.3V to 12V
±2 kV
–65°C to +150°C
+150°C
260°C
Storage Temperature Range
Junction Temperature (T
J-MAX
)
Maximum Lead Temperature (Solder and Reflow)
(1)
(2)
Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the
device is intended to be functional, but device parameter specifications may not be ensured. For specifications and test conditions, see
the Electrical Characteristics. All voltages are with respect to the potential at the GND pin, unless otherwise specified.
Human Body Model, applicable std. JESD22-A114-C.
RECOMMENDED OPERATING CONDITIONS
VALUE / UNITS
Supply Voltage range VCC
Junction Temperature (T
J
)
Thermal Resistance (θ
JA
)
(1)
(1)
13V to 35V
-40°C to +125°C
162°C/W
This R
θJA
typical value determined using JEDEC specifications JESD51-1 to JESD51-11. However junction-to-ambient thermal
resistance is highly board layout dependent. In applications where high maximum power dissipation exists, special care must be paid to
thermal dissipation issues during board design. In high-power dissipation applications, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
= 125°C),
the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (R
θJA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (R
θJA
× P
D-MAX
).
ELECTRICAL CHARACTERISTICS
V
CC
= 18V unless otherwise indicated. Typicals and limits appearing in plain type apply for T
A
= T
J
= +25°C. Limits appearing
in
boldface
type apply over the full Operating Temperature Range. Data sheet minimum and maximum specification limits
are specified by design, test or statistical analysis.
Symbol
Parameter
Conditions
Min
Typ
(1)
Max
Units
SUPPLY VOLTAGE INPUT (VCC)
V
CC-UVLO
VCC Turn on threshold
VCCTurn off threshold
Hysteresis
I
STARTUP
V
CC-OVP
I
VCC
Startup Current
Over voltage protection threshold
Operating supply current
Not switching
65kHz switching
ZERO CROSS DETECT (ZCD)
I
ZCD
V
ZCD-OVP
T
OVP
V
ZCD-ARM
V
ZCD-TRIG
V
ZCD-HYS
I
COMP-SOURCE
ZCD bais current
ZCD over-voltage threshold
Over voltage de-bounce time
ZCD Arming threshold
ZCD Trigger threshold
ZCD Hysteresis
V
ZCD
= Increasing
V
ZCD
= Decreasing
V
ZCD-ARM
-V
ZCD-TRIG
V
COMP
= 2.0V, V
ISNS
= 0V, Measure at COMP pin
1.04
0.48
V
ZCD
= 5V
3.9
0.01
4.3
3
1.23
0.6
0.61
1.42
0.77
1
4.7
uA
V
cycle
V
V
V
V
CC=
V
CC-UVLO
–3.0V
32.7
0.8
22.5 /
21.7
10.4 /
10.1
25.4
12.9
12.5
22.2
35.5
1.2
2.3
25.8
38.0
1.8
3.0
µA
V
mA
mA
28.3 /
29.5
15.3
/ 16.0
V
V
COMPENSATION (COMP)
Internal reference current for primary
side current regulation
27
µA
(1)
Typical numbers are at 25°C and represent the most likely norm.
3
Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links:
TI [ TEXAS INSTRUMENTS ]
