TPS54260
www.ti.com
SLVSA86 –MARCH 2010
PACKAGE DISSIPATION RATINGS(1)
THERMAL IMPEDANCE
JUNCTION TO AMBIENT
PACKAGE
MSOP
57 °C/W
(1) Test board conditions:
A. 3 inches × 3 inches, 2 layers, thickness: 0.062 inch
B. 2-ounce copper traces located on the top and bottom of the PCB
C. 6 (13 mil diameters) THERMAL VIAS LOCATED UNDER THE DEVICE PACKAGE
ELECTRICAL CHARACTERISTICS
TJ = –40°C to 150°C, VIN = 3.5 to 60V (unless otherwise noted)
PARAMETER
SUPPLY VOLTAGE (VIN PIN)
Operating input voltage
TEST CONDITIONS
MIN
TYP
MAX UNIT
3.5
60
V
V
Internal undervoltage lockout
threshold
No voltage hysteresis, rising and falling
EN = 0 V, 25°C, 3.5 V ≤ VIN ≤ 60 V
VSENSE = 0.83 V, VIN = 12 V, 25°C
2.5
1.3
Shutdown supply current
4
mA
Operating : nonswitching supply
current
138
200
ENABLE AND UVLO (EN PIN)
Enable threshold voltage
No voltage hysteresis, rising and falling, 25°C
Enable threshold +50 mV
1.15
1.25
–3.8
–0.9
–2.9
1.36
V
Input current
mA
mA
Enable threshold –50 mV
Hysteresis current
VOLTAGE REFERENCE
TJ = 25°C
0.792
0.784
0.8
0.8
0.808
0.816
Voltage reference
HIGH-SIDE MOSFET
On-resistance
V
VIN = 3.5 V, BOOT-PH = 3 V
VIN = 12 V, BOOT-PH = 6 V
300
200
mΩ
410
ERROR AMPLIFIER
Input current
50
nA
Error amplifier transconductance (gM) –2 mA < ICOMP < 2 mA, VCOMP = 1 V
310
mMhos
–2 mA < ICOMP < 2 mA, VCOMP = 1 V,
VVSENSE = 0.4 V
Error amplifier transconductance (gM)
during slow start
70
mMhos
Error amplifier dc gain
VVSENSE = 0.8 V
10,000
2700
±27
V/V
kHz
mA
Error amplifier bandwidth
Error amplifier source/sink
V(COMP) = 1 V, 100 mV overdrive
COMP to switch current
transconductance
10.5
A/V
CURRENT LIMIT
Current limit threshold
THERMAL SHUTDOWN
VIN = 12 V, TJ = 25°C
3.5
6.1
A
Thermal shutdown
182
°C
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