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TPS54231D 参数 Datasheet PDF下载

TPS54231D图片预览
型号: TPS54231D
PDF下载: 下载PDF文件 查看货源
内容描述: 2A , 28V输入,降压SWIFT ™ DC / DC转换器ECO- MODTM [2A, 28V INPUT, STEP DOWN SWIFT™ DC/DC CONVERTER WITH ECO-MODTM]
分类和应用: 转换器输入元件
文件页数/大小: 23 页 / 795 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TPS54231  
SLUS851OCTOBER 2008.............................................................................................................................................................................................. www.ti.com  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
ORDERING INFORMATION(1)  
TJ  
PACKAGE  
SWITCHING FREQUENCY  
PART NUMBER(2)  
–40°C to 150°C  
8 pin SOIC  
570 kHz  
TPS54231D  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
web site at www.ti.com.  
(2) The D package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54231DR). See applications section of  
data sheet for layout information.  
ABSOLUTE MAXIMUM RATINGS(1)  
over operating free-air temperature range (unless otherwise noted)  
VALUE  
–0.3 to 30  
–0.3 to 5  
38  
UNIT  
VIN  
EN  
BOOT  
Input Voltage  
V
VSENSE  
–0.3 to 3  
–0.3 to 3  
–0.3 to 3  
8
COMP  
SS  
BOOT-PH  
Output Voltage  
Source Current  
Sink Current  
PH  
–0.6 to 30  
–5  
V
PH (10 ns transient from ground to negative peak)  
EN  
100  
µA  
mA  
µA  
A
BOOT  
VSENSE  
PH  
100  
10  
6
VIN  
6
A
COMP  
SS  
100  
µA  
200  
Electrostatic Discharge (HBM)  
Electrostatic Discharge (CDM)  
Operating Junction Temperature  
Storage Temperature  
2
kV  
V
500  
–40 to 150  
–65 to 150  
°C  
°C  
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings  
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating  
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
PACKAGE DISSIPATION RATINGS(1) (2)(3)  
PACKAGE  
THERMAL IMPEDANCE JUNCTION TO  
AMBIENT  
PSEUDO THERMAL IMPEDANCE JUNCTION TO  
TOP  
SOIC8  
100 °C/W  
5 °C/W  
(1) Maximum power dissipation may be limited by overcurrent protection  
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 150°C. This is the point where  
distortion starts to substantially increase. Thermal management of the PCB should strive to keep the junction temperature at or below  
150°C for best performance and long-term reliability. See power dissipation estimate in application section of this data sheet for more  
information.  
(3) Test board conditions:  
a. 2 inches x 1.5 inches, 2 layers, thickness: 0.062 inch  
b. 2-ounce copper traces located on the top and bottom of the PCB  
c. 6 thermal vias located under the device package  
2
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Copyright © 2008, Texas Instruments Incorporated  
Product Folder Link(s): TPS54231