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SLVS398F – JUNE 2001 – REVISED APRIL 2007
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
40°C to 85°C
(1)
(2)
OUTPUT VOLTAGE
Adjustable down to 0.9 V
PACKAGE
(1) (2)
Plastic HTSSOP (PWP)
PART NUMBER
TPS54610PWP
The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54610PWPR). See the application
section of the data sheet for PowerPAD drawing and layout information.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS54610
VIN, SS/ENA, SYNC
V
I
Input voltage range
RT
VSENSE
BOOT
VBIAS, COMP, PWRGD
V
O
Output voltage range
PH
PH (transient < 10 ns)
I
O
Source current
PH
COMP, VBIAS
PH
I
S
Sink current
Voltage differential
T
J
T
stg
(1)
Operating virtual junction temperature range
Storage temperature
COMP
SS/ENA, PWRGD
AGND to PGND
-0.3 V to 7 V
-0.3 V to 6 V
-0.3 V to 4 V
-0.3 V to 17 V
-0.3 V to 7 V
-0.6 V to 10 V
-2 V
Internally Limited
6 mA
12 A
6 mA
10 mA
±0.3
V
-40°C to 125°C
-65°C to 150°C
Stresses beyond those listed under
absolute maximum ratings
may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under
recommended operating
conditions
is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
MIN
Input voltage, V
I
Operating junction temperature, T
J
3
–40
NOM
MAX
6
125
UNIT
V
°C
DISSIPATION RATINGS
(1) (2)
PACKAGE
28 Pin PWP with solder
28 Pin PWP without solder
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
18.2
°C/W
40.5
°C/W
T
A
= 25°C
POWER RATING
5.49 W
(3)
2.48 W
T
A
= 70°C
POWER RATING
3.02 W
1.36 W
T
A
= 85°C
POWER RATING
2.20 W
0.99 W
(1)
(2)
For more information on the PWP package, see TI technical brief, literature number SLMA002.
Test board conditions:
a. 3 inch x 3 inch, 4 layers, thickness: 0.062 inch
b. 1.5 oz. copper traces located on the top of the PCB
c. 1.5 oz. copper ground plane on the bottom of the PCB
d. 0.5 oz. copper ground planes on the 2 internal layers
e. 12 thermal vias (see
Recommended Land Pattern
in applications section of this data sheet
Maximum power dissipation may be limited by over current protection.
(3)
2
TI [ TEXAS INSTRUMENTS ]
