SLVS632E – JANUARY 2006 – REVISED SEPTEMBER 2013
THERMAL INFORMATION
THERMAL METRIC
θ
JA
θ
JA
θ
JA
ψ
JT
ψ
JB
θ
JC(top)
θ
JC(bottom)
θ
JB
(1)
(2)
(3)
(1) (2) (3)
TPS5430
TPS5431
DDA (8 PINS)
(4)
(5)
UNITS
Junction-to-ambient thermal resistance (2-layer custom board)
Junction-to-ambient thermal resistance (4-layer custom board)
Junction-to-ambient thermal resistance (standard board)
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case(top) thermal resistance
Junction-to-case(bottom) thermal resistance
Junction-to-board thermal resistance
33
26
42.3
4.9
20.7
46.4
0.8
20.8
°C/W
(4)
(5)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report,
Maximum power dissipation may be limited by overcurrent protection
Power rating at a specific ambient temperature T
A
should be determined with a junction temperature of 125°C. This is the point where
distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or
below 125°C for best performance and long-term reliability. See
Thermal Calculations
in applications section of this data sheet for more
information.
Test boards conditions:
(a) 3 in x 3 in, 2 layers, thickness: 0.062 inch.
(b) 2 oz. copper traces located on the top and bottom of the PCB.
(c) 6 thermal vias in the PowerPAD area under the device package.
Test board conditions:
(a) 3 in x 3 in, 4 layers, thickness: 0.062 inch.
(b) 2 oz. copper traces located on the top and bottom of the PCB.
(c) 2 oz. copper ground planes on the 2 internal layers.
(d) 6 thermal vias in the PowerPAD area under the device package.
RECOMMENDED OPERATING CONDITIONS
MIN NOM
VIN
T
J
Input voltage range
Operating junction temperature
TPS5430
TPS5431
5.5
5.5
–40
MAX
36
23
125
UNIT
V
°C
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