SGLS376A – FEBRUARY 2007 – REVISED MARCH 2007
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Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
VIN, SS/ENA, FSEL
V
I
Input voltage range
RT
VSENSE
BOOT
V
O
I
O
Output voltage range
Source current
VBIAS, PWRGD, COMP
PH
PH
COMP, VBIAS
PH
Sink current
Voltage differential
T
J
T
stg
Storage temperature
Lead temperature 1,6 mm (1/16 in) from case for 10 s
(1)
COMP
SS/ENA,PWRGD
AGND to PGND
–55
–65
Operating virtual junction temperature range
–0.3
–0.3
–0.3
–0.3
–0.3
–0.6
MAX
7
6
4
17
7
10
6
6
6
10
±0.3
150
150
300
V
V
UNIT
Internally Limited
mA
A
mA
mA
V
°C
°C
°C
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Recommended Operating Conditions
MIN
V
I
T
J
Input voltage range
Operating junction temperature
3
–55
NOM
MAX
6
125
UNIT
V
°C
Package Dissipation Ratings
(1) (2)
PACKAGE
20-Pin PWP with solder
20-Pin PWP without solder
(1)
(2)
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
26°C/W
57.5°C/W
T
A
= 25°C
POWER RATING
3.85 W
(3)
1.73 W
T
A
= 70°C
POWER RATING
2.12 W
0.96 W
T
A
= 85°C
POWER RATING
1.54 W
0.69 W
For more information on the PWP package, see the Texas Instruments technical brief (SLMA002).
Test board conditions:
a. 3 in
×
3 in, 2 layers, Thickness: 0.062 in
b. 1.5 oz copper traces located on the top of the PCB
c. 1.5 oz copper ground plane on the bottom of PCB
d. Ten thermal vias (see the recommended land pattern in the Applications section of this data sheet)
Maximum power dissipation may be limited by overcurrent protection.
(3)
4
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