PACKAGE OPTION ADDENDUM
www.ti.com
11-Aug-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
TBD
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS2000CDGN
TPS2000CDGNR
TPS2001CDGN
TPS2001CDGNR
PREVIEW
PREVIEW
PREVIEW
ACTIVE
MSOP-
PowerPAD
DGN
DGN
DGN
DGN
8
8
8
8
80
2500
80
Call TI
Call TI
Call TI
Call TI
MSOP-
PowerPAD
TBD
Call TI
Call TI
MSOP-
PowerPAD
TBD
MSOP-
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
PowerPAD
TPS2051CDBVR
TPS2051CDBVT
TPS2065CDBVR
TPS2065CDBVT
TPS2065CDGN
PREVIEW
PREVIEW
PREVIEW
PREVIEW
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DGN
5
5
5
5
8
3000
250
3000
250
80
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
TPS2065CDGNR
TPS2069CDGN
TPS2069CDGNR
ACTIVE
ACTIVE
ACTIVE
MSOP-
PowerPAD
DGN
DGN
DGN
8
8
8
2500
80
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
Green (RoHS
& no Sb/Br)
MSOP-
PowerPAD
2500
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
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