TPS1HC30-Q1
ZHCSP75A –JULY 2022 –REVISED DECEMBER 2022
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9.4.2.2 With a GND Network
With a GND network, tie the thermal pad with one trace through the GND network to the board GND copper.
RGND
DGND
RPROT
CVBB_IC
CVBB
G
RPROT
DIAG_
FAU
LAT
S
RPU
RPROT
RPROT
RPROT
CVOUT
RSNS
CFILTER
ILIM
RLI
图9-6. Layout With a GND Network
9.4.3 Thermal Considerations
This device possesses thermal shutdown (TABS) circuitry as a protection from overheating. For continuous
normal operation, the junction temperature must not exceed the thermal-shutdown trip point. If the junction
temperature exceeds the thermal-shutdown trip point, the output turns off. When the junction temperature falls
below the thermal-shutdown trip point, the output turns on again.
Use the following equation to calculate the power dissipated by the device.
PT = IOUT2 ì RDSON + VS ìInom
PT = IOUT 2 × RDSON + VBB × INOM
(17)
where
• PT = Total power dissipation of the device
After determining the power dissipated by the device, calculate the junction temperature from the ambient
temperature and the device thermal impedance.
TJ = TA + RqJA ìPT
TJ = TA + RθJA × PT
(18)
For more information, please see the How to Drive Resistive, Inductive, Capacitive, and Lighting Loads
application note.
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